1config CMD_STBOARD
2	bool "stboard - command for OTP board information"
3	depends on ARCH_STM32MP
4	default y if TARGET_ST_STM32MP15x
5	help
6	  This compile the stboard command to
7	  read and write the board in the OTP.
8
9config MTDPARTS_NAND0_BOOT
10	string "mtd boot partitions for nand0"
11	default "2m(fsbl),2m(ssbl1),2m(ssbl2)"
12	depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
13	help
14	  This define the partitions of nand0 used to build mtparts dynamically
15	  for boot from nand0.
16	  Each partition need to be aligned with the device erase block size,
17	  512KB is the max size for the NAND supported by stm32mp1 platform.
18
19config MTDPARTS_NAND0_TEE
20	string "mtd tee partitions for nand0"
21	default "512k(teeh),512k(teed),512k(teex)"
22	depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
23	help
24	  This define the tee partitions added in mtparts dynamically
25	  when tee is supported with boot from nand0.
26	  Each partition need to be aligned with the device erase block size,
27	  512KB is the max size for the NAND supported by stm32mp1 platform.
28
29config MTDPARTS_NOR0_BOOT
30	string "mtd boot partitions for nor0"
31	default "256k(fsbl1),256k(fsbl2),2m(ssbl),512k(u-boot-env)"
32	depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
33	help
34	  This define the partitions of nand0 used to build mtparts dynamically
35	  for boot from nor0.
36	  Each partition need to be aligned with the device erase block size,
37	  with 256KB we support all the NOR.
38	  U-Boot env partition (512kB) use 2 erase block for redundancy.
39
40config MTDPARTS_NOR0_TEE
41	string "mtd tee partitions for nor0"
42	default "256k(teeh),512k(teed),256k(teex)"
43	depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
44	help
45	  This define the tee partitions added in mtparts dynamically
46	  when tee is supported with boot from nor0.
47
48config MTDPARTS_SPINAND0_BOOT
49	string "mtd boot partitions for spi-nand0"
50	default "2m(fsbl),2m(ssbl1),2m(ssbl2)"
51	depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
52	help
53	  This define the partitions of nand0 used to build mtparts dynamically
54	  for boot from spi-nand0,
55	  512KB is the max size for the NAND supported by stm32mp1 platform.
56
57config MTDPARTS_SPINAND0_TEE
58	string "mtd tee partitions for spi-nand0"
59	default "512k(teeh),512k(teed),512k(teex)"
60	depends on SYS_MTDPARTS_RUNTIME && ARCH_STM32MP
61	help
62	  This define the tee partitions added in mtparts dynamically
63	  when tee is supported with boot from spi-nand0,
64	  512KB is the max size for the NAND supported by stm32mp1 platform.
65
66config DFU_ALT_RAM0
67	string "dfu for ram0"
68	default "uImage ram 0xc2000000 0x2000000;devicetree.dtb ram 0xc4000000 0x100000;uramdisk.image.gz ram 0xc4400000 0x10000000"
69	depends on ARCH_STM32MP && SET_DFU_ALT_INFO
70	help
71	  This defines the partitions of ram used to build dfu dynamically.
72
73config TYPEC_STUSB160X
74	tristate "STMicroelectronics STUSB160X Type-C controller driver"
75	depends on DM_I2C
76	help
77	  Say Y if your system has STMicroelectronics STUSB160X Type-C port
78	  controller.
79