1STMicroelectronics STM32MP1
2===========================
3
4STM32MP1 is a microprocessor designed by STMicroelectronics
5based on a dual Arm Cortex-A7.
6It is an Armv7-A platform, using dedicated code from TF-A.
7The STM32MP1 chip also embeds a Cortex-M4.
8More information can be found on `STM32MP1 Series`_ page.
9
10
11STM32MP1 Versions
12-----------------
13The STM32MP1 series is available in 3 different lines which are pin-to-pin compatible:
14
15- STM32MP157: Dual Cortex-A7 cores, Cortex-M4 core @ 209 MHz, 3D GPU, DSI display interface and CAN FD
16- STM32MP153: Dual Cortex-A7 cores, Cortex-M4 core @ 209 MHz and CAN FD
17- STM32MP151: Single Cortex-A7 core, Cortex-M4 core @ 209 MHz
18
19Each line comes with a security option (cryptography & secure boot) and a Cortex-A frequency option:
20
21- A      Basic + Cortex-A7 @ 650 MHz
22- C      Secure Boot + HW Crypto + Cortex-A7 @ 650 MHz
23- D      Basic + Cortex-A7 @ 800 MHz
24- F      Secure Boot + HW Crypto + Cortex-A7 @ 800 MHz
25
26The `STM32MP1 part number codification`_ page gives more information about part numbers.
27
28Design
29------
30The STM32MP1 resets in the ROM code of the Cortex-A7.
31The primary boot core (core 0) executes the boot sequence while
32secondary boot core (core 1) is kept in a holding pen loop.
33The ROM code boot sequence loads the TF-A binary image from boot device
34to embedded SRAM.
35
36The TF-A image must be properly formatted with a STM32 header structure
37for ROM code is able to load this image.
38Tool stm32image can be used to prepend this header to the generated TF-A binary.
39
40Boot with FIP
41~~~~~~~~~~~~~
42The use of FIP is now the recommended way to boot STM32MP1 platform.
43Only BL2 (with STM32 header) is loaded by ROM code. The other binaries are
44inside the FIP binary: BL32 (SP_min or OP-TEE), U-Boot and their respective
45device tree blobs.
46
47STM32IMAGE bootchain
48~~~~~~~~~~~~~~~~~~~~
49Although still supported, this way of booting is not recommended.
50Pease use FIP instead.
51At compilation step, BL2, BL32 and DTB file are linked together in a single
52binary. The stm32image tool is also generated and the header is added to TF-A
53binary. This binary file with header is named tf-a-stm32mp157c-ev1.stm32.
54It can then be copied in the first partition of the boot device.
55
56
57Memory mapping
58~~~~~~~~~~~~~~
59
60::
61
62    0x00000000 +-----------------+
63               |                 |   ROM
64    0x00020000 +-----------------+
65               |                 |
66               |       ...       |
67               |                 |
68    0x2FFC0000 +-----------------+ \
69               |     BL32 DTB    | |
70    0x2FFC5000 +-----------------+ |
71               |       BL32      | |
72    0x2FFDF000 +-----------------+ |
73               |       ...       | |
74    0x2FFE3000 +-----------------+ |
75               |     BL2 DTB     | | Embedded SRAM
76    0x2FFEA000 +-----------------+ |
77               |       BL2       | |
78    0x2FFFF000 +-----------------+ |
79               |  SCMI mailbox   | |
80    0x30000000 +-----------------+ /
81               |                 |
82               |       ...       |
83               |                 |
84    0x40000000 +-----------------+
85               |                 |
86               |                 |   Devices
87               |                 |
88    0xC0000000 +-----------------+ \
89               |                 | |
90    0xC0100000 +-----------------+ |
91               |       BL33      | | Non-secure RAM (DDR)
92               |       ...       | |
93               |                 | |
94    0xFFFFFFFF +-----------------+ /
95
96
97Boot sequence
98~~~~~~~~~~~~~
99
100ROM code -> BL2 (compiled with BL2_AT_EL3) -> BL32 (SP_min) -> BL33 (U-Boot)
101
102or if Op-TEE is used:
103
104ROM code -> BL2 (compiled with BL2_AT_EL3) -> OP-TEE -> BL33 (U-Boot)
105
106
107Build Instructions
108------------------
109Boot media(s) supported by BL2 must be specified in the build command.
110Available storage medias are:
111
112- ``STM32MP_SDMMC``
113- ``STM32MP_EMMC``
114- ``STM32MP_RAW_NAND``
115- ``STM32MP_SPI_NAND``
116- ``STM32MP_SPI_NOR``
117
118Boot with FIP
119~~~~~~~~~~~~~
120You need to build BL2, BL32 (SP_min or OP-TEE) and BL33 (U-Boot) before building FIP binary.
121
122U-Boot
123______
124
125.. code:: bash
126
127    cd <u-boot_directory>
128    make stm32mp15_trusted_defconfig
129    make DEVICE_TREE=stm32mp157c-ev1 all
130
131OP-TEE (optional)
132_________________
133
134.. code:: bash
135
136    cd <optee_directory>
137    make CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm PLATFORM=stm32mp1 \
138        CFG_EMBED_DTB_SOURCE_FILE=stm32mp157c-ev1.dts
139
140
141TF-A BL32 (SP_min)
142__________________
143If you choose not to use OP-TEE, you can use TF-A SP_min.
144To build TF-A BL32, and its device tree file:
145
146.. code:: bash
147
148    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
149        AARCH32_SP=sp_min DTB_FILE_NAME=stm32mp157c-ev1.dtb bl32 dtbs
150
151TF-A BL2
152________
153To build TF-A BL2 with its STM32 header for SD-card boot:
154
155.. code:: bash
156
157    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
158        DTB_FILE_NAME=stm32mp157c-ev1.dtb STM32MP_SDMMC=1
159
160For other boot devices, you have to replace STM32MP_SDMMC in the previous command
161with the desired device flag.
162
163This BL2 is independent of the BL32 used (SP_min or OP-TEE)
164
165
166FIP
167___
168With BL32 SP_min:
169
170.. code:: bash
171
172    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
173        AARCH32_SP=sp_min \
174        DTB_FILE_NAME=stm32mp157c-ev1.dtb \
175        BL33=<u-boot_directory>/u-boot-nodtb.bin \
176        BL33_CFG=<u-boot_directory>/u-boot.dtb \
177        fip
178
179With OP-TEE:
180
181.. code:: bash
182
183    make CROSS_COMPILE=arm-none-eabi- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
184        AARCH32_SP=optee \
185        DTB_FILE_NAME=stm32mp157c-ev1.dtb \
186        BL33=<u-boot_directory>/u-boot-nodtb.bin \
187        BL33_CFG=<u-boot_directory>/u-boot.dtb \
188        BL32=<optee_directory>/tee-header_v2.bin \
189        BL32_EXTRA1=<optee_directory>/tee-pager_v2.bin
190        BL32_EXTRA2=<optee_directory>/tee-pageable_v2.bin
191        fip
192
193
194STM32IMAGE bootchain
195~~~~~~~~~~~~~~~~~~~~
196You need to add the following flag to the make command:
197``STM32MP_USE_STM32IMAGE=1``
198
199To build with SP_min and support for SD-card boot:
200
201.. code:: bash
202
203    make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
204        AARCH32_SP=sp_min STM32MP_SDMMC=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb \
205        STM32MP_USE_STM32IMAGE=1
206
207    cd <u-boot_directory>
208    make stm32mp15_trusted_defconfig
209    make DEVICE_TREE=stm32mp157c-ev1 all
210
211To build TF-A with OP-TEE support for SD-card boot:
212
213.. code:: bash
214
215    make CROSS_COMPILE=arm-linux-gnueabihf- PLAT=stm32mp1 ARCH=aarch32 ARM_ARCH_MAJOR=7 \
216        AARCH32_SP=optee STM32MP_SDMMC=1 DTB_FILE_NAME=stm32mp157c-ev1.dtb \
217        STM32MP_USE_STM32IMAGE=1
218
219    cd <optee_directory>
220    make CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm PLATFORM=stm32mp1 \
221        CFG_EMBED_DTB_SOURCE_FILE=stm32mp157c-ev1.dts
222
223    cd <u-boot_directory>
224    make stm32mp15_trusted_defconfig
225    make DEVICE_TREE=stm32mp157c-ev1 all
226
227
228The following build options are supported:
229
230- ``ENABLE_STACK_PROTECTOR``: To enable the stack protection.
231
232
233Populate SD-card
234----------------
235
236Boot with FIP
237~~~~~~~~~~~~~
238The SD-card has to be formatted with GPT.
239It should contain at least those partitions:
240
241- fsbl: to copy the tf-a-stm32mp157c-ev1.stm32 binary (BL2)
242- fip: which contains the FIP binary
243
244Usually, two copies of fsbl are used (fsbl1 and fsbl2) instead of one partition fsbl.
245
246STM32IMAGE bootchain
247~~~~~~~~~~~~~~~~~~~~
248The SD-card has to be formatted with GPT.
249It should contain at least those partitions:
250
251- fsbl: to copy the tf-a-stm32mp157c-ev1.stm32 binary
252- ssbl: to copy the u-boot.stm32 binary
253
254Usually, two copies of fsbl are used (fsbl1 and fsbl2) instead of one partition fsbl.
255
256OP-TEE artifacts go into separate partitions as follows:
257
258- teeh: tee-header_v2.stm32
259- teed: tee-pageable_v2.stm32
260- teex: tee-pager_v2.stm32
261
262
263.. _STM32MP1 Series: https://www.st.com/en/microcontrollers-microprocessors/stm32mp1-series.html
264.. _STM32MP1 part number codification: https://wiki.st.com/stm32mpu/wiki/STM32MP15_microprocessor#Part_number_codification
265